Hyoung Joon Kim

A study on wafer level TSV build-up integration method

Jun-Yeob Song, Jae Hak Lee, Tae Ho Ha, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

High reliability insert-bump bonding process for 3D integration

Jae Hak Lee, Tae Ho Ha, Jun-Yeob Song, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)

Srinivasa Rao Vempati, Chee Houe Khong, Ser Choong Chong, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Curing and bonding behaviors of anisotropic conductive films (ACFs) by ultrasonic vibration for flip chip interconnection

Ki Won Lee, Hyoung Joon Kim, Myung Jin Yim, 2006, 56th Electronic Components and Technology Conference 2006.

Numerical study of preventing flow-induced die-shift in the compression molding for embedded wafer level packaging

Shan Gao, Damaruganath Pinjala, Lin Ji, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Development of Via in Mold (ViM) for embedded wafer level package (EWMLP)

Soon Wee Ho, Ser Choong Chong, Hyoung Joon Kim, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds

Michael Mayer, Jeong-Tak Moon, Hyoung Joon Kim, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.