T. C. Chai

Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay

C. S. Premachandran, Xiaowu Zhang, T. C. Chai, 2001, SPIE MOEMS-MEMS.

Study on packaging issues using FEA and experimental verification on Si based capacitive microrelay

C. S. Premachandran, Xiaowu Zhang, T. C. Chai, 2001 .

Investigation for lateral diecrack on SIP power device

C. S. Premachandran, T. C. Chai, E. M. Palmeda, 1997, Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Thermal design and analysis of through silicon interposer (TSI) package

T. C. Chai, Lin Bu, Yong Han, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Development of numerical modeling approach on substrate warpage prediction

T. C. Chai, Shiguo Liu, Kalyan Biswas, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

A novel defect detection technique using active transient thermography for high density package and interconnections

T. C. Chai, A. Trigg, A. Trigg, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Reliability assessment of flipchip on build up laminate based multi-chip package

D. Pinjala, T. C. Chai, C. Lee, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests

T. C. Chai, V.P.W. Shim, Chwee Teck Lim, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).