J. C. Bolger

HRE-3 PRESSURIZER DESIGN

J. C. Bolger, R. O. Maak, 1958 .

Area bonding conductive (ABC) adhesives for flex circuit connection to LTCC/MCM substrates

J. C. Bolger, M. Reynolds, J. Popielarczyk, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Prediction and measurement of thermal conductivity of diamond filled adhesives

J. C. Bolger, J. Bolger, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

The Plastic Flow Behavior of Flocculated Kaolin Suspensions

J. C. Bolger, A. Michaels, J. Bolger, 1962 .

Area bonding conductive epoxy adhesives for low cost grid array chip carriers

J. C. Bolger, J. M. Czarnowski, 1995 .