Y. C. Chan

Michael G. Pecht, Sachin Kumar, Y. C. Chan, 2008, 2008 IEEE International Joint Conference on Neural Networks (IEEE World Congress on Computational Intelligence).

Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow?

Y. C. Chan, A. L. Brown, R. Smit, 2008, Environ. Model. Softw..

Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film

Y. C. Chan, M. O. Alam, H. P. Chan, 2004, Microelectron. Reliab..

Reliability of microBGA assembly using no-flow underfill

Y. C. Chan, P. L. Tu, K. C Hung, 2001, Microelectron. Reliab..

Bias-HAST on tape ball grid array (TBGA) test pattern

Y. C. Chan, N. H. Yeung, Victor Lau, 2004, Microelectron. Reliab..

No-flow underfill flip chip assembly--an experimental and modeling analysis

Y. C. Chan, K. C. Hung, H. Lu, 2002, Microelectron. Reliab..

Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects

Y. C. Chan, Y. W. Chiu, S. M. Lui, 2002, Microelectron. Reliab..

Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders

Y. C. Chan, Asit Kumar Gain, 2014, Microelectron. Reliab..

Research advances in nano-composite solders

J. Shen, Y. C. Chan, Y. Chan, 2009, Microelectron. Reliab..

Effect of microwave preheating on the bonding performance of flip chip on flex joint

Y. C. Chan, Rashed Adnan Islam, 2004, Microelectron. Reliab..

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

Y. C. Chan, Asit Kumar Gain, Ahmed Sharif, 2010, Microelectron. Reliab..

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Y. C. Chan, Asit Kumar Gain, Winco K. C. Yung, 2011, Microelectron. Reliab..

Contact resistance and adhesion performance of ACF interconnections to aluminum metallization

Y. C. Chan, M. O. Alam, J. H. Zhang, 2003, Microelectron. Reliab..

FORTLOG = Fortran + Logique

Y. C. Chan, 1985, SPLT.

Self-Monitoring and Self-Assessing Atomic Clocks

Y. C. Chan, W. A. Johnson, J. C. Camparo, 2010, IEEE Transactions on Instrumentation and Measurement.

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

Y. C. Chan, Ze Zhu, Fengshun Wu, 2018, Microelectron. Reliab..

Study of micro-BGA solder joint reliability

Y. C. Chan, Joseph K. L. Lai, P. L. Tu, 2001, Microelectron. Reliab..

Thermal stability performance of anisotropic conductive film at different bonding temperatures

Y. C. Chan, C. W. Tan, Y. W. Chiu, 2004, Microelectron. Reliab..

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y. C. Chan, D. Y. Luk, Y. Chan, 2002, Microelectron. Reliab..

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

Y. C. Chan, M. O. Alam, M. N. Islam, 2003, Microelectron. Reliab..

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

Chris Bailey, Chunyan Yin, Hua Lu, 2003, Microelectron. Reliab..

Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications

Y. C. Chan, S. H. Fan, Y. Chan, 2002, Microelectron. Reliab..

Effect on properties of 42Sn58Bi solder joint by adding the 96.5Sn3.5Ag

Y. C. Chan, Xiaoguang Pan, Qinghua Tang, 2000, Other Conferences.

Study of anisotropic conductive adhesive joint behavior under 3-point bending

Chris Bailey, Hua Lu, Y. C. Chan, 2005, Microelectron. Reliab..

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

Y. C. Chan, Asit Kumar Gain, Ahmed Sharif, 2010, Microelectronics Reliability.

Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Y. C. Chan, M. O. Alam, Y. P. Wu, 2004, Microelectron. Reliab..

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

Y. C. Chan, Guangbin Dou, Y. Chan, 2003 .

Reliability studies /spl mu/BGA solder joints-effect of Ni-Sn intermetallic compound

Y. C. Chan, K. C. Hung, Joseph K. L. Lai, 2001 .

Comparative study of micro-BGA reliability under bending stress

Y. C. Chan, K. C. Hung, P. L. Tu, 2000 .

Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

Y. C. Chan, Hau Ping Chan, M. O. Alam, 2003 .

Vibration fatigue of /spl mu/BGA solder joint

Y. C. Chan, Joseph K. L. Lai, P. L. Tu, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2009 .

Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

Y. C. Chan, Asit Kumar Gain, Y. Chan, 2015, Journal of Materials Science: Materials in Electronics.

Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5%Ag solders during high-temperature aging with Ni/Au metallization

Y. C. Chan, Ahmed Sharif, Y. Chan, 2004 .

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Y. C. Chan, Rashed Adnan Islam, 2005 .

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Y. C. Chan, Winco K.C. Yung, Ahmed Sharif, 2011 .

Correlation between Ni_3Sn_4 intermetallics and Ni_3P due to solder reaction-assisted crystallization of electroless Ni–P metallization in advanced packages

Y. C. Chan, K. C Hung, H. C. Ong, 2000 .

The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing

Chris Bailey, Y. C. Chan, Ahmed Sharif, 2005 .

Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

Y. C. Chan, Winco K.C. Yung, Ahmed Sharif, 2009 .

Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow

Y. C. Chan, M. O. Alam, K. C. Hung, 2002 .

Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints

Y. C. Chan, Y. Chan, A. So, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications

Y. C. Chan, Y. Chan, S. C. Tan, 2005 .

Solid-state growth kinetics of Ni3Sn4 at the Sn–3.5Ag solder∕Ni interface

Y. C. Chan, M. O. Alam, Y. Chan, 2005 .

Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

Y. C. Chan, Y. Chan, Jiaxuan Zhang, 2003 .

Anisotropic Conductive Adhesives for Flip-Chip Interconnects

Michael Pecht, Y. C. Chan, Weiqiang Wang, 2008 .

Electromigration of Pb-free solder under a low level of current density

Feng Wu, Y. C. Chan, Y. Chan, 2008 .

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2010 .

Experimental studies of pore formation in surface mount solder joints

D. J. Xie, Y. C. Chan, Y. Chan, 1996 .

Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Chris Bailey, Y. C. Chan, Hua Lu, 2006 .

Influence of Dopants on Room Temperature Insulation Resistivity of Lead Magnesium Niobate Based Ceramics

Yu Wang, Y. C. Chan, Zhilun Gui, 1998 .

Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

Chris Bailey, Chunyan Yin, Y. C. Chan, 2013 .

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2010 .

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y. C. Chan, Y. Chan, Dan-Liang Yang, 2010 .

The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints

Y. C. Chan, Y. Chan, J. Lai, 1997 .

The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads

Y. C. Chan, Asit Kumar Gain, 2012 .

Modelling the effect of voids in anisotropic conductive adhesive joints

Y. C. Chan, N. H. Yeung, K. K. Lee, 2005 .

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Y. C. Chan, M. O. Alam, King-Ning Tu, 2004 .

Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

Andrew D. Holland, Y. C. Chan, Brian Ralph, 2006 .

Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

Y. C. Chan, Ahmed Sharif, Y. Chan, 2005 .

Fracture mechanics analysis of solder joint intermetallic compounds in shear test

Chris Bailey, Y. C. Chan, M. O. Alam, 2009 .

Porosity formation and its effects on mechanical properties of SMT solder joints

I. K. Hui, D. J. Xie, Y. C. Chan, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering

Y. C. Chan, Ahmed Sharif, Y. Chan, 2005 .

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

Y. C. Chan, M. O. Alam, King-Ning Tu, 2006 .

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

D. P. Webb, Y. C. Chan, G. Y. Li, 2000 .

Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints

Y. C. Chan, S. H. Fan, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Effect of Bonding Force on the Conducting Particle With Different Sizes

Y. C. Chan, N. H. Yeung, C. W. Tan, 2003 .

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Y. C. Chan, P. L. Tu, Y. P. Wu, 2001 .

Effect of pinhole Au:Ni:Cu substrate on self-alignment of advanced packages

Y. C. Chan, P. L. Tu, K. C Hung, 2000 .

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Y. C. Chan, P. L. Tu, P. Tu, 1997 .

Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects

Y. C. Chan, Hua Lu, C. Bailey, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing

Y. C. Chan, K. C. Hung, Y. Chan, 2000 .

The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing

Y. C. Chan, King-Ning Tu, Y. Chan, 2008 .

Electric field effects on short-circuiting between adjacent joints in fine pitch anisotropically conductive adhesive interconnections

Y. C. Chan, Y. W. Chiu, S. M. Lui, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Role of bonding time and temperature on the physical properties of coupled anisotropic conductive-nonconductive adhesive film for flip chip on glass technology

Chris Bailey, Y. C. Chan, Hua Lu, 2008 .

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Y. C. Chan, Y. Chan, M. N. Islam, 2005 .

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Y. C. Chan, Winco K.C. Yung, Asit Kumar Gain, 2011 .

Moisture effects on the reliability of ACF interconnections

Chris Bailey, Chunyan Yin, Hua Lu, 2005 .

Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

Y. C. Chan, K. C. Hung, C. W. Tang, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Open Defects in PBGA Assembly Solder Joints

Y. C. Chan, J. K. L. Lai, S. H. Fan, 2003 .

Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Y. C. Chan, M. J. Rizvi, W. Jillek, 2005 .

Effects of soft beam energy on the microstructure of Pb37Sn, Au20Sn, and Sn3.5Ag0.5Cu solder joints in lensed-SM-fiber to laser-diode-affixing application

Y. C. Chan, Y. Chan, C. W. Tan, 2008 .

Aging effects on shear fatigue life and shear strength of soldered thick film joints

Y. C. Chan, Y. Chan, G. Y. Li, 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B.

Thermomigration in eutectic tin-lead flip chip solder joints

Y. C. Chan, M. O. Alam, B. Y. Wu, 2006 .

Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

Y. C. Chan, Y. Chan, J. Lai, 2000 .