Shin Nakao

Chip scale package (CSP) "a lightly dressed LSI chip"

T. Tachikawa, Shinji Baba, Mitsuyasu Matsuo, 1994, Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.

High Thermal Conduction Package Technology for Flip Chip Devices

M. Kohara, Hideki Shibata, H. Nakata, 1983 .

Trend of VLSI Packaging Technology

Shin Nakao, 1994 .

New developed of thin plastic package with high terminal counts

O. Nakagawa, Y. Nemoto, Masanobu Kohara, 1990 .

Chip scale package: "a lightly dressed LSI chip"

T. Tachikawa, Shinji Baba, Hironori Matsushima, 1995 .