V. Balan
发表
G. Ghibaudo,
J. Cluzel,
C. Carabasse,
2014,
2014 IEEE International Electron Devices Meeting.
F. Fournel,
A. Jouve,
Y. Henrion,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Zussy,
J. Dechamp,
A. Jouve,
2019,
2019 International 3D Systems Integration Conference (3DIC).
E. Deloffre,
A. Jouve,
S. Lhostis,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
X. Garros,
O. Rozeau,
O. Faynot,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).
Annie Pradel,
Andreu Llobera,
C. Vigreux,
2003
.
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
L. Di Cioccio,
S. Chevobbe,
P. Coudrain,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Annie Pradel,
C. Vigreux,
V. Balan,
2004
.
O. Rozeau,
M. Vinet,
J. Lacord,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
F. Fournel,
F. Gigon,
E. Deloffre,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
L. Arnaud,
F. Fournel,
A. Farcy,
2017,
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
X. Garros,
G. Ghibaudo,
M.-P. Samson,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).
X. Garros,
P. Batude,
M. Vinet,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
O. Rozeau,
O. Faynot,
M. Vinet,
2016,
2016 IEEE International Electron Devices Meeting (IEDM).