Cho-Liang Chung

Modeling of multi-layered structure containing heterogeneous material layer with randomly distributed particles using infinite element method

De-Shin Liu, Zhen-Wei Zhuang, Ching-Yang Chen, 2010, Microelectron. Reliab..

Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package)

Yao-Jung Lee, Cho-Liang Chung, Liang-Tien Lu, 2005, Microelectron. Reliab..

An implantable bi-directional wireless transmission system for transcutaneous biological signal recording

Chua-Chin Wang, Jia-Jin Jason Chen, Chih-Kuo Liang, 2005, Physiological measurement.

Failure mode investigation of die pick process with high speed camera and numerical analysis

De-Shin Liu, Cho-Liang Chung, Chieh-Jung Lu, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Yi Li, Cho-Liang Chung, Yi Li, 2005 .