J. Arcamone

M&NEMS: A new approach for ultra-low cost 3D inertial sensor

G. Jourdan, Ph. Robert, L. Duraffourg, 2009, 2009 IEEE Sensors.

Ultra-scaled high-frequency single-crystal Si NEMS resonators and their front-end co-integration with CMOS for high sensitivity applications

O. Rozeau, K. Benotmane, G. Cibrario, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

Future challenges and opportunities for heterogeneous process technology. Towards the thin films, Zero Intrinsic Variability devices, Zero Power era

P. Batude, M. Vinet, F. Andrieu, 2014, 2014 IEEE International Electron Devices Meeting.

3D Sequential Integration: Application-driven technological achievements and guidelines

X. Garros, O. Rozeau, O. Faynot, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Full wafer integration of NEMS on CMOS by nanostencil lithography

G. Abadal, N. Barniol, F. Serra-Graells, 2006, 2006 International Electron Devices Meeting.

Pirani gauge based on alternative self-heating of silicon nanowire

C. Dupre, D. Mercier, L. Duraffourg, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).