V. Szekely

发表

M. Rencz, V. Szekely, S. Torok, 2001, IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188).
M. Rencz, V. Szekely, A. Poppe, 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.
M. Rencz, V. Szekely, B. Courtois, 1996, Proceedings of International Conference on Microelectronic Test Structures.
M. Rencz, V. Szekely, G. Farkas, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..
M. Rencz, V. Szekely, A. Poppe, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
M. Rencz, V. Szekely, M. Rencz, 2004, IEEE Transactions on Components and Packaging Technologies.
J.H. Huijsing, V. Szekely, K.A.A. Makinwa, 2002, IMTC/2002. Proceedings of the 19th IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.00CH37276).
M. Rencz, V. Szekely, 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..
M. Rencz, V. Szekely, A. Poppe, 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
M. Rencz, V. Szekely, A. Poppe, 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).
M. Rencz, V. Szekely, B. Courtois, 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.
M. Rencz, V. Szekely, Yan Zhang, 2006, IEEE Transactions on Components and Packaging Technologies.
M. Rencz, V. Szekely, A. Poppe, 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).
M. Rencz, A. Pahi, V. Szekely, 1999, 1999 Southwest Symposium on Mixed-Signal Design (Cat. No.99EX286).
M. Rencz, S. Mir, V. Szekely, 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).
M. Rencz, V. Szekely, A. Poppe, 2007, IEEE Transactions on Components and Packaging Technologies.
M. Rencz, V. Szekely, B. Courtois, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).
M. Rencz, V. Szekely, B. Courtois, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).
M. Rencz, B. Courtois, V. Szekely, 1998 .
M. Rencz, V. Szekely, A. Poppe, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
V. Szekely, B. Courtois, M. Renez, 1999, 1999 Southwest Symposium on Mixed-Signal Design (Cat. No.99EX286).
M. Rencz, V. Szekely, A. Poppe, 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
V. Szekely, A. Poppe, G. Hajas, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
V. Szekely, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
V. Szekely, B. Courtois, 1996, IEEE International Workshop on Memory Technology, Design and Testing,.
M. Rencz, V. Szekely, A. Poppe, 2000, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426).
M. Rencz, V. Szekely, A. Poppe, 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).
M. Rencz, V. Szekely, C. Villa, 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).
M. Rencz, V. Szekely, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).
M. Rencz, V. Szekely, 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).
M. Rencz, B. Hofflinger, V. Szekely, 1997, 27th European Solid-State Device Research Conference.
M. Rencz, V. Szekely, A. Poppe, 2002, 4th Electronics Packaging Technology Conference, 2002..
M. Rencz, V. Szekely, A. Poppe, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).
M. Rencz, V. Szekely, 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
M. Rencz, V. Szekely, A. Poppe, 2003, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003..
M. Rencz, V. Szekely, G. Somlay, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.
M. Rencz, V. Szekely, B. Courtois, 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).
V. Szekely, S. Torok, E. Kollar, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
M. Rencz, V. Szekely, A. Poppe, 2005, IEEE Transactions on Components and Packaging Technologies.
M. Rencz, V. Szekely, A. Poppe, 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.