N. Suzumura

A New TDDB Degradation Model Based on Cu Ion Drift in Cu Interconnect Dielectrics

K. Makabe, E. Murakami, N. Suzumura, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Study on vertical TDDB degradation mechanism and its relation to lateral TDDB in Cu/low-k damascene structures

M. Ogasawara, N. Suzumura, T. Furuhashi, 2014, 2014 IEEE International Reliability Physics Symposium.

Electric-field and temperature dependencies of TDDB degradation in Cu/Low-K damascene structures

E. Murakami, N. Suzumura, D. Kodama, 2008, 2008 IEEE International Reliability Physics Symposium.

Comprehensive lifetime prediction for intrinsic and extrinsic TDDB failures in Cu/Low-k interconnects

T. Ouchi, K. Makabe, E. Murakami, 2011, 2011 IEEE International Interconnect Technology Conference.