Tz-Cheng Chiu

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz-Cheng Chiu, En-Yu Yeh, T. Chiu, 2018, Microelectron. Reliab..

IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

Cemal Basaran, Flavio Canavero, Ephraim Suhir, 2010 .

Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

Vikas Gupta, Hung-Chun Yang, Jyun-Ji Lin, 2010, Microelectronics Reliability.

Warpage evolution of overmolded ball grid array package during post-mold curing thermal process

Yi-Shao Lai, Hong-Wei Huang, Tz-Cheng Chiu, 2011, Microelectron. Reliab..

Interconnect reliability modeling for lead-free fan-out chip scale package

Hung-Chun Yang, Tz-Cheng Chiu, Yu-Ren Chen, 2008, 2008 International Conference on Electronic Materials and Packaging.

A numerical procedure for simulating delamination growth on interfaces of interconnect structures

Tz-Cheng Chiu, Chun-Hui Chen, 2012, Microelectron. Reliab..

Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics

Yu-Ting Yang, Tz-Cheng Chiu, Bo-Sheng Lee, 2015, Microelectron. Reliab..

Design optimization for wafer level package by using sequential optimization and reliability assessment method

Tz-Cheng Chiu, Jung-Chuan Chien, 2016, 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Stress-induced voiding under vias connected to wide Cu metal leads

Joe W. McPherson, M. K. Jain, William R. McKee, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kazuaki Ano, Darvin R. Edwards, King-Ning Tu, 2005 .