L. Borucki

Causal analysis of conditioner design factors on removal rates in copper CMP

Naoki Rikita, Hyosang Lee, Yun Zhuang, 2006 .

Rapid thermal modeling for smart-power and integrated multichip power circuit design

J.-M. Dorkel, P. Tounsi, P. Dupuy, 1996, 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings.

Effect of Slurry Flow Rate on Tribological, Thermal, and Removal Rate Attributes of Copper CMP

Ara Philipossian, L. Borucki, L. Borucki, 2004 .

Plastic flow during thermal oxidation of silicon

Robert W. Dutton, C. S. Rafferty, L. Borucki, 1989 .

FEDSS: a 2D semiconductor fabrication process simulator

L. Borucki, K. Varahramyan, K. Varahramyan, 1985 .

Modeling of Transient Heating in Smart Power Applications

L. Borucki, 1995 .

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

Yun Zhuang, Ara Philipossian, L. Borucki, 2010 .