Troy Graves-Abe

3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS

Alberto Cestero, Sami Rosenblatt, Gary Maier, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Three-dimensional wafer stacking using Cu TSV integrated with 45nm high performance SOI-CMOS embedded DRAM technology

Toshiaki Kirihata, John Golz, Alex Hubbard, 2013, 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Bonding technologies for chip level and wafer level 3D integration

Katsuyuki Sakuma, Sayuri Kohara, Kuniaki Sueoka, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).