Siddharth Easwar

Multi-layer floorplanning for reliable system-on-package

Sung Kyu Lim, Ramprasad Ravichandran, Pun Hang Shiu, 2004, 2004 IEEE International Symposium on Circuits and Systems (IEEE Cat. No.04CH37512).

Wire congestion and thermal aware 3D global placement

Sung Kyu Lim, Karthik Balakrishnan, Vidit Nanda, 2005, ASP-DAC.