Y. T. Lin

Defect prediction for reactive ion etching using neural networks

Gary S. May, V. Chen, D. Stokes, 1997, Proceedings of International Conference on Neural Networks (ICNN'97).

Applying novel non-destructive failure analysis techniques on the package related failures

P. S. Kuo, Y. T. Lin, C. H. Chu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069]

Y. T. Lin, Y. T. Lin, Kim Shyong Siow, 2016 .

Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging

Kuo-Ning Chiang, Y. T. Lin, K. Chiang, 2002 .

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

Y. T. Lin, Kim Shyong Siow, K. Siow, 2016 .

Deposition uniformity inspection in IC wafer surface

Y. T. Lin, W. Li, J. Jeng, 2014 .