C. A. Neugebauer

Electronic packaging and interconnection technology: state of the art and future developments

C. A. Neugebauer, 1990, IEEE International Symposium on Circuits and Systems.

The Direct Bonding of Metals to Ceramics and Application in Electronics

C. A. Neugebauer, J. F. Burgess, G. Flanagan, 1976 .

Materials for high-density electronic packaging and interconnections in the higher packaging levels

C. A. Neugebauer, 1989 .

Packaging technology for smart power applications

C. A. Neugebauer, 1991, [1991] Proceedings of the 3rd International Symposium on Power Semiconductor Devices and ICs.

The Packaging of power semiconductor devices

C. A. Neugebauer, 1986 .

Electrical Conduction Mechanism in Ultrathin, Evaporated Metal Films

C. A. Neugebauer, C. Neugebauer, M. B. Webb, 1962 .

Voids, Cracks, and Hot Spots in Die Attach

C. A. Neugebauer, J. F. Burgess, A. J. Yerman, 1983, 21st International Reliability Physics Symposium.

Multilevel interconnections for wafer scale integration

C. A. Neugebauer, J. F. McDonald, Andrew J. Steckl, 1986 .