Ikuo Shohji

发表

Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation

Hideo Mori, Ikuo Shohji, Yasumitsu Orii, 2004, Microelectron. Reliab..

Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder

Ikuo Shohji, Shinichi Yoshida, Jun Watanabe, 2019, Applied Sciences.

New lead free solder composition and physical properties of printed wiring board laminate material to suppress lift-off and improve reliability

Ikuo Shohji, Tatsuhiko Asai, Hideki Ishihara, 2006 .

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

Ikuo Shohji, Zhang Haidong, Masayoshi Shimoda, 2016 .

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity

Ikuo Shohji, Susumu Hioki, Takehiko Takahashi, 2004 .

Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Lead-Free Solder

Ikuo Shohji, Hirohiko Watanabe, I. Shohji, 2006 .

Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

Ikuo Shohji, Kojiro F. Kobayashi, I. Shohji, 2001 .

Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders

Osamu Kamiya, Ikuo Shohji, Susumu Hioki, 2005 .

Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index

Ikuo Shohji, Tadashi Takemoto, Kiyokazu Yasuda, 2005 .

Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders

Ikuo Shohji, Susumu Hioki, Takehiko Takahashi, 2002 .