Raleigh Estrada

3D X-Ray microscopy: A non destructive high resolution imaging technology that replaces physical cross-sectioning for 3DIC packaging

Luke Hunter, Bruce Johnson, Y. L. Kuo, 2013, ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.

3D X-ray microscopy: A near-SEM non-destructive imaging technology used in the development of 3D IC packaging

Luke Hunter, Bruce Johnson, Yuri Sylvester, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

Raleigh Estrada, Morgan Cason, 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Application of 3D X-ray microscopy for 3D IC process development

Ingrid De Wolf, Allen Gu, Teng Wang, 2016 .