R. Doring

Reliability Prediction of Area Array Solder Joints

Bernd Michel, Rainer Dudek, R. Doring, 2003 .

Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling

R. Doring, S. Rzepka, R. Dudek, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Do chip size limits exist for DCA?

C.P. Wong, H. Reichl, R. Leutenbauer, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Do chip size limits exist for DCA

Herbert Reichl, Rao Tummala, Madhavan Swaminathan, 1999 .

Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls

S. Wiese, R. Doring, S. Rzepka, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability

R. Doring, B. Seiler, R. Dudek, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).