B.A. Zahn

Optimizing cost and thermal performance: rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package

B.A. Zahn, 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

Evaluation and simplified and complex thermal finite element models for 3-die stacked chip scale ball grid array package

B.A. Zahn, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

Thermal testing of a 3-die stacked chip scale package including evaluation of simplified and complex package geometry finite element models

B.A. Zahn, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.