K. C. Leong

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

J. Wei, Dau Fatt Lim, Xiao Fang Ang, 2012, Microelectron. Reliab..

Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone

Dau Fatt Lim, C. S. Tan, K. C. Leong, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.