A. Chow

A novel MCM package enabling proximity communication I-O

H. Thacker, I. Shubin, J. E. Cunningham, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

I. Shubin, J. E. Cunningham, A. V. Krishnamoorthy, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

A package demonstration with solder free compliant flexible interconnects

I. Shubin, E. M. Chow, N. Nettleton, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).