Hirofumi Nakajima

Semiconductor packages for automotive applications

Hirofumi Nakajima, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

High-speed, low-power device trend and low-k layer delamination

Hirofumi Nakajima, H. Nakajima, 2012, 2012 14th International Conference on Electronic Materials and Packaging (EMAP).

30.2: Flexible OLEDs Poster with Gravure Printing Method

Hirofumi Nakajima, Toshihiko Takeda, Daigo Aoki, 2005 .