Chih-Ming Chen

发表

Effect of polyimide baking on bump resistance in flip-chip solder joints

Tzeng-Feng Liu, Shien-Ping Feng, Hsi-Kuei Cheng, 2014, Microelectron. Reliab..

Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate

Chih-Ming Chen, Yee-Wen Yen, Ruo-Syun Syu, 2014, Microelectron. Reliab..

Electromigration of Sn-9wt.%Zn Solder

Chih-Ming Chen, Chih-Ming Chen, Yu-min Hung, 2008 .

Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes

Ray-Hua Horng, Dong-Sing Wuu, Yu-Li Tsai, 2010, IEEE Transactions on Electron Devices.

Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material

Ray-Hua Horng, Dong-Sing Wuu, Chia-Ju Chen, 2010 .

Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing

Chi-Pu Lin, Chih-Ming Chen, Chi-Pu Lin, 2009 .

A High-Temperature Die-Bonding Structure Fabricated at Low Temperature for Light-Emitting Diodes

Ray-Hua Horng, Dong-Sing Wuu, Chi-Chang Hu, 2015, IEEE Electron Device Letters.

Electromigration of Sn8 wt.% Zn3 wt.% Bi and Sn9 wt.% Zn1 wt.% Cu solders

Chih-Ming Chen, C. Lin, Chih-Ming Chen, 2009 .

Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing

Chih-Ming Chen, Chih-Ming Chen, Chih-Fan Lin, 2012, Metallurgical and Materials Transactions A.

Microstructural evolution of the Au–20 wt.% Sn solder on the Cu substrate during reflow

Chi-Pu Lin, Chia-Ju Chen, Chih-Ming Chen, 2009 .

Retarding the Cu 5Zn 8 phase fracture at the Sn9 wt.% Zn/Cu interface

Chih-Ming Chen, Chih-Ming Chen, Chih-Fan Lin, 2011 .

Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization

Chih-Ming Chen, Chih-Ming Chen, Kai-jheng Wang, 2007 .