Yu-Jiau Hwang

A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

Yu-Fang Chen, Shu-Ming Chang, Kuo-Ning Chiang, 2007, IEEE Transactions on Advanced Packaging.

A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

Shyh-Shyuan Sheu, Kuan-Neng Chen, Yao-Jen Chang, 2012, IEEE Transactions on Device and Materials Reliability.

Flexible and ultra-thin embedded chip package

Hsiang-Hung Chang, Cheng-Ta Ko, Yu-Hua Chen, 2009, 2009 59th Electronic Components and Technology Conference.

The development of enhanced wafer level packaging

Shu-Ming Chang, Wei-Chung Lo, Li-Cheng Shen, 2002, 4th Electronics Packaging Technology Conference, 2002..