A. Sridhar

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

F. Krismer, B. Michel, J. Kolar, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Analysis and comparative evaluation of stacked-transistor half-bridge topologies implemented with 14 nm bulk CMOS technology

J. W. Kolar, F. Krismer, T. Toifl, 2017, 2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL).