Siraj Fulum Mossa

Grouped through silicon vias for lower Ldi/dt drop in three-dimensional integrated circuit

Syed Rafay Hasan, Siraj Fulum Mossa, Omar Sayed Ahmed Elkeelany, 2016, IET Circuits Devices Syst..

Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

Syed Rafay Hasan, Falah Awwad, Siraj Fulum Mossa, 2015, 2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS).

Hardware trojans in 3-D ICs due to NBTI effects and countermeasure

Omar S. Elkeelany, Syed Rafay Hasan, Siraj Fulum Mossa, 2017, Integr..

Introducing redundant TSV with low inductance for 3-D IC

Syed Rafay Hasan, Siraj Fulum Mossa, Omar Sayed Ahmed Elkeelany, 2014, 2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS).

Investigation of reliability and security issues in through silicon via based three-dimensional integrated circuits

Siraj Fulum Mossa, 2016 .

Hardware Trojans in asynchronous FIFO-buffers: From clock domain crossing perspective

Syed Rafay Hasan, Falah Awwad, Siraj Fulum Mossa, 2015, 2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS).

Self-triggering hardware trojan: Due to NBTI related aging in 3-D ICs

Omar S. Elkeelany, Syed Rafay Hasan, Siraj Fulum Mossa, 2017, Integr..