Xiaoning Ye

发表

Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers

James L. Drewniak, Bruce Archambeault, Min Li, 2000 .

An Efficient Pico-Probe Error Box Removal Method

Xiaoning Ye, Eric Gantner, Nathan Tan, 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).

Robust Extended Unterminated Line (EUL) Crosstalk Characterization Techniques for High-Speed Interconnect

Jun Fan, Zurab Kiguradze, Xiaoning Ye, 2020, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

PCB layer reduction to save system BOM cost in an Intel Haswell-EP server platform

Wei Xu, Zhenhua Yuan, Xiaoning Ye, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Switching voltage regulator noise coupling to connector signal pins through near field radiation

Jiangqi He, Yinglei Ren, Wei Xu, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Crosstalk analysis for dual stripline with parallel and angled routing

Xinjun Zhang, Weifeng Shu, Yinglei Ren, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Fast signal integrity methodology for PCB pre-layout analysis and layout quality check

Jimmy Hsu, Xiaoning Ye, Kai Xiao, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Introduction to the 2016 IEEE EMC Symposium Special Issue

Xiaoning Ye, Syed Bokhari, 2017 .

Accurate characterization of PCB transmission lines for high speed interconnect

Jun Fan, James L. Drewniak, Xiaoning Ye, 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).

De-embedding errors due to inaccurate test fixture characterization

Xiaoning Ye, 2012, IEEE Electromagnetic Compatibility Magazine.

Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines

Jun Fan, Xiaoning Ye, Yuandong Guo, 2020, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Method and applications of oscilloscope waveform de-embedding

Xiaoning Ye, B. Smith, P. Fornberg, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.

Advanced On-chip SOL Calibration Method for Unknown Fixture De-embedding

Jun Fan, Changwook Yoon, Xiaoning Ye, 2017 .

Error bounds analysis of de-embedded results in 2x thru de-embedding methods

Jun Fan, Xiaoning Ye, Bichen Chen, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Interconnect impedance optimization for high speed IO up to 12Gbps under HVM condition

Xinjun Zhang, Ming Wei, Weifeng Shu, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Novel through hole absorber for suppression of power noise, crosstalk and EMI

Xiaoning Ye, Beomtaek Lee, Shaowu Huang, 2017 .

Detect VR noise coupling sources through near field scanning

Xiaoning Ye, A. Luoh, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Novel characterization technique with short and open standards

Xiaoning Ye, Kai Xiao, Shaowu Huang, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

EMI resulting from signal via transitions through the DC power bus

James L. Drewniak, Bruce Archambeault, Min Li, 2000, IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016).

Comparison of the access level of new energy between domestic and foreign power grid

Liang Xu, Xiaoning Ye, Wei Yuan, 2020 .

Stub Effect Mitigations Using Absorbing Materials

Xiaoning Ye, Kai Xiao, Beomtaek Lee, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Full link impedance optimization for serial IOs

Xiaoning Ye, Chunfei Ye, E. J. Vargas, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Channel quality comparison for OOGIO bus designs

Xiaoning Ye, Kai Xiao, Y. L. Li, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Unintended passive resonant structures in interconnect designs for multi-gigabit signaling

Xiaoning Ye, Kai Xiao, J. Hock, 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

Comparison of TRL calibration vs. 2x thru de-embedding methods

Xiaoning Ye, Se-Jung Moon, Rex Smith, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Watch the EMC society: Virtual & webinar events: Now available on-demand

Zhiping Yang, Xiaoning Ye, Vignesh Rajamani, 2020 .

Wide-band E-shaped patch antennas for wireless communications

Xiaoning Ye, Fan Yang, Xue-Xia Zhang, 2001 .

Study of TDR Impedance for Better Analysis to Measurement Correlation

Jimmy Hsu, Jun Fan, Xiaoning Ye, 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).

Debugging and analysis of a new noise coupling mechanism in computer system

Weifeng Shu, Yinglei Ren, Xiaoning Ye, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

2X-Thru De-embedding for Non-2N Even Number Port Network

Jun Fan, Xiaoning Ye, Bichen Chen, 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).

Fixture crosstalk assessment structure for VNA measurement how to quantify fixture crosstalk when it is not completely de-embeded?

Xiaoning Ye, Hansel Dsilva, Se-Jung Moon, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Jun Fan, Antonio Orlandi, Bruce Archambeault, 2010, IEEE Transactions on Electromagnetic Compatibility.

Cost-effective characterization of dissipative loss of printed circuit board traces

Jimmy Hsu, Xiaoning Ye, Kai Xiao, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Building accurate Spice models for multi-Gbps interconnect in computer systems

Xiaoning Ye, Chung-Chi Huang, Kai Xiao, 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

EMI reduction techniques for InfiniBand multi-GHz interconnect

Xiaoning Ye, Alok Tripathi, Dennis Miller, 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.

Switching voltage regulator noise coupling to signal lines in a server system

Xiaoning Ye, Gong Ouyang, Trung-Thu Nguyen, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Improve storage IO performance by using 85Ohm package and motherboard routing

Xiaoning Ye, Chunfei Ye, Thanh Do-Nguyen, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

DC blocking capacitor design and optimization for high speed signalling

Xinjun Zhang, Weifeng Shu, Xiaoning Ye, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Printed circuit board insertion loss measurement metrology comparison

Jimmy Hsu, Xiaoning Ye, Kai Xiao, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Transmission Lines and Basic Signal Integrity

Xiaoning Ye, Chunfei Ye, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).

Research on Mechanism and Benefits of Frequency Regulation of Energy Storage Combined with Thermal Power Unit

Wei Yuan, Xiaoning Ye, Caixia Wang, 2019, 2019 IEEE 3rd Conference on Energy Internet and Energy System Integration (EI2).

Via pattern design and optimization for differential signaling 25Gbps and above

Xiaoning Ye, Chunfei Ye, Enrique Lopez Miralrio, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Differential far-end crosstalk cancellation — Implementations and challenges

Xiaoning Ye, Kai Xiao, R. Enriquez, 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

A novel de-embedding method suitable for transmission-line measurement

Jun Fan, Xiaoning Ye, Bichen Chen, 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).

Editorial: Introduction to the Special Issue for the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity

Xiaoning Ye, 2020 .

The EMI benefits of ground plane stitching in multi-layer power bus stacks

James L. Drewniak, Wei Cui, Xiaoning Ye, 2000, IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016).

Board-level signal integrity methodology

Yanjie Zhu, Xiaoning Ye, Kai Xiao, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Application of hybrid PCB stackup

Yinglei Ren, Xiaoning Ye, Chunfei Ye, 2017, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Dual-striplines design optimizations for minimum crosstalk

Jimmy Hsu, Weifeng Shu, Yinglei Ren, 2015, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC).

New De-Embedding Techniques for PCB Transmission-Line Characterization

James L. Drewniak, Xiaoning Ye, Jun Fan, 2015 .

Multi-Ports ([$2^{n}$) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization

Jun Fan, Xiaoning Ye, Siming Pan, 2019, IEEE Transactions on Electromagnetic Compatibility.

Detection of electronic mines, timers, and fuses through electromagnetic interference signatures and stimulated emissions

James L. Drewniak, Xiaoning Ye, Wei Cui, 2000, Defense, Security, and Sensing.

Evaluating high-speed link performance using direct end-to-end measurement

Xiaoning Ye, Kai Xiao, Chunfei Ye, 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

Checking PCB design electrically for PI/SI issues

Jimmy Hsu, Weifeng Shu, Xiaoning Ye, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Analytical and numerical sensitivity analyses of fixtures de-embedding

Jun Fan, Xiaoning Ye, Shuai Jin, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

EMI resulting from a signal via transition through DC power bus-effectiveness of focal SMT decoupling

James L. Drewniak, Bruce Archambeault, Min Li, 2000, Proceedings. Asia-Pacific Conference on Environmental Electromagnetics. CEEM'2000 (IEEE Cat. No.00EX402).

Efficient time-domain vector fitting for broadband interconnect modelling

Xiaoning Ye, Se-Jung Moon, Andreas Cangellaris, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Signaling enabler in high-speed system design by using hybrid stackup printed circuit board

Jimmy Hsu, Xiaoning Ye, Thonas Su, 2013, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards

Jun Fan, Xiaoning Ye, Xinglin Sun, 2017, IEEE Transactions on Electromagnetic Compatibility.

Sensitivity Analysis of Local Soldermask and Coverlay in High Speed Transimission Lines for DDR5 Applications to Reduce FEXT

Jun Fan, Xiaoning Ye, Xin Cao, 2020, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Transmission lines and signal integrity fundamentals

Xiaoning Ye, Chunfei Ye, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Fast channel performance evaluation using time domain metrics

Weifeng Shu, Xiaoning Ye, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

SNEM: Full S-Parameter Synthesis From Near-End Measurement

Xiaoning Ye, Yunhui Chu, Kai Xiao, 2017, IEEE Transactions on Electromagnetic Compatibility.

A new design flow to evaluate high-speed SerDes link performance with re-driver

Nick Peterson, Yinglei Ren, Xiaoning Ye, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Standard development update: IEEE P370 — electrical characterization of printed circuit board and related interconnects at frequencies up to 50 GHz

Xiaoning Ye, 2020 .

Improve signal integrity performance by using hybrid PCB stackup

Jimmy Hsu, Xiaoning Ye, Thonas Su, 2013, 2013 IEEE International Symposium on Electromagnetic Compatibility.

Rigorous one-port measurement method for the characterization of on-chip pad response

Xiaoning Ye, Kai Xiao, Beomtaek Lee, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Delta-L methodology for efficient PCB trace loss characterization

Jimmy Hsu, Xiaoning Ye, Kai Xiao, 2014, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Intentional and un-intentional far end crosstalk cancellation in high speed differential link

Xiaoning Ye, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Design Optimization for Minimal Crosstalk in Differential Interconnect

Xiaoning Ye, Beomtaek Lee, Intel Corp, 2012 .

Physics-based fitting to improve PCB loss measurement accuracy

Xiaoning Ye, Marko Balogh, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Differential S-Parameter De-embedding for 8-Port Network

Jun Fan, Xiaoning Ye, Xinglin Sun, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).

Signal integrity design of via with extra routing stub for device routing flexibility

Jimmy Hsu, Xiaoning Ye, Thonas Su, 2013, 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS).

Extended Unterminated Line (EUL) for accurate and efficient crosstalk measurement

Varun Gupta, Xiaoning Ye, Albert Sutono, 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).

System Level Impact of Stitching Vias and Capacitors for High-Speed Differential Links

Xiaoning Ye, Min Wang, R.N. Shryock, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Modeling issues for full-wave numerical EMI simulation

Chen Wang, Xiaoning Ye, James L. Drewniak, 2003, 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446).

Improve electrical performance of interconnects using inkjet printing

Xiaoning Ye, Kai Xiao, Shaowu Huang, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

An Efficient Approach to Find the Truncation Frequency for Transmission Line-Based Dielectric Material Property Extraction

Jun Fan, Xiaoning Ye, Xinglin Sun, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).

Advances and applications of the finite difference time domain (FDTD) method and scattering parameter measurement techniques for electromagnetic compatibility in high speed digital design

Xiaoning Ye, X. Ye, 2000 .

Probe with absorbing materials

Xiaoning Ye, Kai Xiao, Shaowu Huang, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

High-speed differential IO crosstalk — The impact of phase, bit rate, jitter and equalization

Xiaoning Ye, Chunfei Ye, Brian Wang, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

EMC Society Standards Update: IEEE 370-2020 Now Published! Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies Up To 50 GHz

Xiaoning Ye, 2021, IEEE Electromagnetic Compatibility Magazine.

Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations

Xiaoning Ye, Shuai Jin, Bichen Chen, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

DesignCon 2011 Methods for Discovering and Mitigating Switching Regulator Noise Coupling for Complex PCB System

Xiaoning Ye, Amy Luoh, Yuan-Liang Li, 2010 .

A Flexible and efficient bit error rate simulation method for high-speed differential link analysis using time-domain interpolation and superposition

Xiaoning Ye, Kai Xiao, Beomtaek Lee, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.

Characterization of Insertion Loss of Striplines on Various Substrate Materials as a Function of Temperature

Jimmy Hsu, Xiaoning Ye, Chong-Jin Ong, 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).