A. Trigg

Introduction to the Special Issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

K. L. Pey, A. Trigg, S. Chung, 2005 .

Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

K. L. Pey, M. K. Radhakrishnan, A. Trigg, 2004 .

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

Chee Lip Gan, F. X. Che, W. N. Putra, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.