Don Mullen

Measurement and characterization of backplanes for serial links operating at 56 Gbps

Wendemagegnehu T. Beyene, Yeon-Chang Hahm, Dave Secker, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Design of low cost QFP packages for multi-gigabit memory interface

Yi Lu, Dan Oh, Joong-Ho Kim, 2009, 2009 59th Electronic Components and Technology Conference.

Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond

Jihong Ren, Yeon-Chang Hahm, Dave Secker, 2014 .

Design and testing of a high speed module based memory system

Ravi Kollipara, Chuck Yuan, Chris Madden, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

Signal and power integrity analysis of a 256-GB/s double-sided IC package with a memory controller and 3D stacked DRAM

Scott Best, Hai Lan, Ming Li, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Evaluation of a module based memory system with an LCP flex interconnect

Ravi Kollipara, Chuck Yuan, Chris Madden, 2009, 2009 59th Electronic Components and Technology Conference.

Design, modeling, and characterization of passive channels for data rates of 50 Gbps and beyond

Wendemagegnehu Beyene, Dave Secker, Yuriy Shlepnev, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).