D. Suhl

Investigations of Large PLCC Package Cracking During Surface Mount Exposure

T. Steiner, D. Suhl, T. Steiner, 1987 .

Thermally induced IC package cracking

D. Suhl, 1990, InterSociety Conference on Thermal Phenomena in Electronic Systems.

Sockets: considerations as an alternative to direct surface mounting of components

D. Suhl, P. Pellerite, 1988, Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium.

The mechanism of plastic package cracking in SMT and two solutions

D. Suhl, M. Kirloskar, T. O. Steiner, 1988, Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium.