F. Pompeo

Multi-chip package thermal management of IBM z-server systems

G. Messina, S. Singh, A. Arvelo, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Phase change materials as a viable thermal interface material for high-power electronic applications

F. Pompeo, C. Ramaswamy, S. Shinde, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology

F. Pompeo, K. Sakuma, K. Sakuma, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.