K. Karimanal

Use of shell conduction plates for compact models of extruded heat sinks in forced convection environments

M. Nagulapally, K. Karimanal, M. Nagulapally, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Use of zero thickness conducting plate object in electronics cooling applications of CFD

K. Karimanal, R. Nair, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

CPI challenges to BEOL at 28nm node and beyond

Chirag Shah, J. Paul, Vivian Ryan, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).