David Copeland

Low profile heat pipe heat sink and green performance characterization for next generation CPU module thermal designs

George Meyer, Marlin Vogel, Guoping Xu, 2010, 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Preliminary specification for a closed loop liquid cooling system product reliability test plan

Marlin Vogel, David Copeland, Margaret Stern, 2009, 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Thermo-mechanical reliability considerations with dynamic voltage/frequency scaling in microprocessor applications

David Copeland, Sai Ankireddi, 2009, 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.