Sevket U. Yuruker

System-Level Thermal Modeling and Its Significance in Electronics Packaging

Michael Ohadi, Patrick McCluskey, Sevket U. Yuruker, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics

Michael M. Ohadi, Avram Bar-Cohen, Patrick McCluskey, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermo-Mechanical Design Considerations in 3D-Integrated SiC Power Device Package

Sevket U. Yuruker, M. Ohadi, A. Khaligh, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, M. Ohadi, A. Khaligh, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. Yuruker, Zhi Yang, Bao Yang, 2018 .

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, M. Ohadi, P. McCluskey, 2021 .

Highly Compressible, Anisotropic Aerogel with Aligned Cellulose Nanofibers.

Sevket U. Yuruker, Boyang Liu, Liangbing Hu, 2017, ACS nano.

System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. Yuruker, Zhi Yang, Bao Yang, 2018, Frontiers in Energy.