Masahide Goto

发表

Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers

Hiroshi Ohtake, Hiroshi Toshiyoshi, Yoshinori Iguchi, 2015, 2015 International 3D Systems Integration Conference (3DIC).

A Study on a Readout Circuit with High Signal to Noise Ratio for a CMOS Image Sensor overlaid with a HARP Layer

Hiroshi Ohtake, Kenkichi Tanioka, Toshihide Watanabe, 2001 .

Three-Layered Stacking Process by Au/SiO 2 Hybrid Bonding for 3D Structured Image Sensors

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2017 .

無機エレクトレットを用いた電荷蓄積型シリコンマイクロホン;無機エレクトレットを用いた電荷蓄積型シリコンマイクロホン;Silicon Electret Condenser Microphone with Inorganic Electret

Yoshinori Iguchi, Masahide Goto, Kei Hagiwara, 2012 .

Pixel-Parallel 3D Integrated CMOS Image Sensors Developed by Direct Bonding of SOI Layers for Next-Generation Video Systems

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Research and Development on Next-Generation Image Sensors by Using Three-Dimensional Integration Technology

Masahide Goto, 2018 .

Fabrication of Pixel Circuits for 3D-Structured CMOS Image Sensors

Masahide Goto, 2014 .

Fabrication of Electret Using Soft X-ray Irradiation for Silicon Microphone

Yoshinori Iguchi, Masahide Goto, Kei Hagiwara, 2010 .

Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel Signal Processors

Hiroshi Ohtake, Hiroshi Toshiyoshi, Yoshinori Iguchi, 2015 .

In-pixel A/D converters with 120-dB dynamic range using event-driven correlated double sampling for stacked SOI image sensors

Hiroshi Toshiyoshi, Yuki Honda, Eiji Higurashi, 2016, 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

1-3 Topics (3); Image sensors with new principle and structure and their application systems

Masahide Goto, 2018 .

11-3 Development of elemental technology for 3D-integrated image sensors

Hiroshi Ohtake, Hiroshi Toshiyoshi, Yoshinori Iguchi, 2013 .

New signal readout method for ultrahigh-sensitivity CMOS image sensor

Hiroshi Ohtake, M. Abe, H. Maruyama, 2003 .

Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2018, 2018 IEEE International Symposium on Circuits and Systems (ISCAS).

(Invited) Pixel-Parallel 3-D Integrated CMOS Image Sensors for Next-Generation Video Systems

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2018 .

(Invited) Development of Novel Three-Dimensional Structuring of Integrated Circuits by Using Low Temperature Direct Bonding for CMOS Image Sensors

Hiroshi Ohtake, Hiroshi Toshiyoshi, Yoshinori Iguchi, 2014 .

(Invited) Pixel-Parallel CMOS Image Sensors with 16-Bit A/D Converters Developed by 3-D Integration of SOI Layers with Au/SiO2 Hybrid Bonding

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2016 .

A new readout circuit for an ultra high sensitivity CMOS image sensor

Hiroshi Ohtake, Masahide Goto, Toshihisa Watabe, 2002, 2002 Digest of Technical Papers. International Conference on Consumer Electronics (IEEE Cat. No.02CH37300).

Quarter Video Graphics Array Digital Pixel Image Sensing With a Linear and Wide- Dynamic-Range Response by Using Pixel-Wise 3-D Integration

Hiroshi Toshiyoshi, Yoshinori Iguchi, Yuki Honda, 2019, IEEE Transactions on Electron Devices.

Development of a three-dimensional integrated image sensor with pixel-parallel signal processing architecture

Hiroshi Ohtake, Hiroshi Toshiyoshi, Yoshinori Iguchi, 2015, 2015 IEEE SENSORS.

Wide-Dynamic-Range Digital-Pixel CMOS Image Sensor Applying New Readout Operation

Hiroshi Ohtake, Masahide Abe, Masahide Goto, 2006, IEICE Trans. Electron..

Fixed Pattern Noise Reduction for a CMOS Image Sensor Overlaid with a HARP Film

Hiroshi Ohtake, Kenkichi Tanioka, H. Maruyama, 2003 .

Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2014 .

Broadcast Technology

Kazuho Ono, Kenkichi Tanioka, Yoshinori Iguchi, 2002 .

Mechanical grinding of Au/SiO2 hybrid-bonded substrates for 3D integrated image sensors

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2014, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

128 × 96 Pixel-parallel three-dimensional integrated CMOS image sensors with 16-bit A/D converters: By direct bonding with embedded Au electrodes

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2015, 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

A novel MOSFET with vertical signal‐transfer capability for 3D‐structured CMOS image sensors

Hiroshi Toshiyoshi, Yoshinori Iguchi, Toshiro Hiramoto, 2014 .

Pixel-Parallel 3-D Integrated CMOS Image Sensors With Pulse Frequency Modulation A/D Converters Developed by Direct Bonding of SOI Layers

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2015, IEEE Transactions on Electron Devices.

Silicon microphone with wide frequency range and high linearity

Masakazu Iwaki, Kenkichi Tanioka, Yoshinori Iguchi, 2007 .

3-D Silicon-on-Insulator Integrated Circuits With NFET and PFET on Separate Layers Using Au/SiO2 Hybrid Bonding

Hiroshi Toshiyoshi, Yoshinori Iguchi, Eiji Higurashi, 2014, IEEE Transactions on Electron Devices.

Soft X-ray Charging Method for a Silicon Electret Condenser Microphone

Yoshinori Iguchi, Masahide Goto, Kei Hagiwara, 2010 .