E. Kinsbron

High accelerated lifetime test methods and procedures for VLSI microcircuit interconnection line certification

E. Weis, E. Kinsbron, G. Chanoch, 1991, Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's.

ELECTROMIGRATION EFFECTS IN VLSI DUE TO VARIOUS CURRENT TYPES

B. Vogel, E. Weis, E. Kinsbron, 1991, 1991, Proceedings. International Test Conference.

Analysis of electromigration effects within various types of aluminum test structures

N. Croitoru, M. M. Snyder, E. Kinsbron, 1992 .

Electromigration‐induced failure by edge displacement in fine‐line aluminum‐0.5% copper thin film conductors

E. Kinsbron, A. T. English, 1983 .

Dielectric properties of heavily doped crystalline and amorphous silicon from 1.5 to 6.0 eV

David E. Aspnes, A. A. Studna, E. Kinsbron, 1984 .

Electromigration transport mobility associated with pulsed direct current in fine‐grained evaporated Al‐0.5%Cu thin films

E. Kinsbron, A. T. English, 1983 .

Failure of Small Thin Film Conductors Due to High Current-Density Pulses

C. M. Melliar-Smith, E. Kinsbron, A. T. English, 1978, 16th International Reliability Physics Symposium.

A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes

E. Kinsbron, E. Kinsbron, 1980 .

Electromigration in thin gold films on molybdenum surfaces

E. Kinsbron, I. Blech, E. Kinsbron, 1975 .

The threshold current density and incubation time to electromigration in gold films

Yigal Komem, E. Kinsbron, I. Blech, 1977 .