B. Xie

Method for monitoring environmental degradation of adhesive bonds

S. I. Rokhlin, Arturo Baltazar, B. Xie, 2002 .

Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices

Xuejun Fan, B. Xie, B. Xie, 2010 .

Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design

B. Xie, C. H. Chung, X. Q. Shi, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).