L. Chitu

Marking of materials by CO2 laser beam scanning

Constantin Blanaru, D. C. Dumitras, Ramona Cernat, 2003, Other Conferences.

<200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS

E. Deloffre, A. Jouve, S. Lhostis, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Improved technologies for marking of different materials

A. Puiu, Ramona Cernat, D. C. Dumitras, 2003 .

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

F. Fournel, F. Gigon, E. Deloffre, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).