S. Pienimaa

Evaluation of Inkjet Technology for Electronic Packaging and System Integration

H. Saito, M. Mantysalo, J. Miettinen, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

High volume capable direct chip attachment methods

S. Pienimaa, K. Kulojarvi, J.K. Kivilahti, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).