V. Rajaraman
发表
E. Cretu,
V. Rajaraman,
I. Sabageh,
2011
.
Robust Wafer-Level Thin-Film Encapsulation of Microstructures using Low Stress PECVD Silicon Carbide
V. Rajaraman,
P.M. Sarro,
H.T.M. Pham,
2009,
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.