K. S. Siow

发表

K. S. Siow, K. Siow, 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging.

B. Y. Majlis, K. S. Siow, T. F. Chen, 2015, 2015 IEEE Conference on Sustainable Utilization And Development In Engineering and Technology (CSUDET).

A. S. Zuruzi, K. S. Siow, A. Zuruzi, 2015, Electronic Materials Letters.

K. S. Siow, S. T. Chua, Z. A. Samah, 2018, 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).

K. S. Siow, Y. Mei, Z. Wang, 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging.

K. S. Siow, Kim Shyong Siow, K. Siow, 2014, Journal of Electronic Materials.

K. S. Siow, K. Siow, 2012, 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

K. S. Siow, Y. W. Chan, F. Husna, 2015, 2015 IEEE Conference on Sustainable Utilization And Development In Engineering and Technology (CSUDET).

K. S. Siow, Y. W. Chan, B. Yeop Majlis, 2016, Materials science & engineering. C, Materials for biological applications.

K. S. Siow, B. Majlis, P. Ng, 2020, Materials science & engineering. C, Materials for biological applications.

K. S. Siow, H. Griesser, Sunil Kumar, 2019, Colloids and surfaces. B, Biointerfaces.

K. S. Siow, B. Majlis, Tiam Foo Chen, 2017, Materials science & engineering. C, Materials for biological applications.

K. S. Siow, B. Majlis, M. A. Mohamed, 2016, 2016 IEEE International Conference on Semiconductor Electronics (ICSE).

K. S. Siow, B. Majlis, A. A. Hamzah, 2018, 2018 IEEE International Conference on Semiconductor Electronics (ICSE).

K. S. Siow, S. T. Chua, A. Jalar, 2014, 36th International Electronics Manufacturing Technology Conference.