Seungjun Noh

发表

Large-area die-attachment by silver stress migration bonding for power device applications

Hao Zhang, Katsuaki Suganuma, Chuantong Chen, 2018, Microelectron. Reliab..

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver

Dongjin Kim, Katsuaki Suganuma, Chuantong Chen, 2018, Microelectron. Reliab..

Heat-resistant die-attach with cold-rolled Ag sheet

Katsuaki Suganuma, Chuantong Chen, Seungjun Noh, 2017 .