Y. Yagi

Miniaturized receiver front-end hybrid ICs for mobile communication equipment using flip-chip bonding technology

J. Itoh, Y. Yagi, K. Takahashi, 1995, Proceedings of 1995 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Conjunction with INTER COMM'95).

Miniaturized 90 degree hybrid coupler using high dielectric substrate for QPSK modulator

Y. Yagi, H. Tanaka, Y. Sasaki, 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.