Dag Andersson

Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors

Hans Grönqvist, Niina Hernandez, Jan Wipenmyr, 2018, 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

SMARTER-SI - Smart access to manufacturing for Systems Integration

Kepa Mayora, Guy Voirin, Arndt Steinke, 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

Model verification of heat exchangers in a flow test rig

Klas Brinkfeldt, Dag Andersson, Olaf Zschieschang, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.