G.V. Kopcsay

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

T.-M. Winkel, H. Grabinski, E. Klink, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

New methodology for combined Simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks

A. Deutsch, G.V. Kopcsay, B.L. Krauter, 2006, IEEE Transactions on Advanced Packaging.

Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks

A. Deutsch, G.V. Kopcsay, B.L. Krauter, 2004, Electrical Performance of Electronic Packaging - 2004.

A Holistic Approach to System Reliability in Blue Gene

G.V. Kopcsay, L. Mok, A. Gara, 2006, International Workshop on Innovative Architecture for Future Generation High Performance Processors and Systems (IWIA'06).

A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis

A. Deutsch, G.V. Kopcsay, I.M. Elfadel, 2004, IEEE Transactions on Advanced Packaging.

The importance of inductance and inductive coupling for on-chip wiring

A. Deutsch, G.A. Katopis, G.V. Kopcsay, 1997, Electrical Performance of Electronic Packaging.

Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique

T.-M. Winkel, A. Deutsch, G.A. Katopis, 2005, IEEE Transactions on Advanced Packaging.

When are transmission-line effects important for on-chip interconnections

K.A. Jenkins, G.V. Kopcsay, C.W. Surovic, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Creating the BlueGene/L supercomputer from low-power SoC ASICs

G.V. Kopcsay, A. Gara, V. Salapura, 2005, ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005..

Understanding common-mode noise on wide data-buses

A. Deutsch, G.V. Kopcsay, C.W. Surovic, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Determination of transmission line parameters in time- and frequency domain for product related packaging structures

T.-M. Winkel, A. Deutsch, G.A. Katopis, 2007, 2007 IEEE Workshop on Signal Propagation on Interconnects.