Guo-Quan Lu

Three-dimensional packaging for power semiconductor devices and modules

J.G. Bai, J.N. Calata, Xingsheng Liu, 2005, IEEE Transactions on Advanced Packaging.

Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint

Guo-Quan Lu, Xu Chen, Xin Li, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver Paste

Guo-Quan Lu, Xu Chen, Gang Chen, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.