F. C. Voogt

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

Kirsten Weide-Zaage, R. Roucou, R. T. H. Rongen, 2014, Microelectron. Reliab..

Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined With LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating

F. Roozeboom, M. Saadaoui, P. M. Sarro, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Reliability of Wafer Level Chip Scale Packages

Kirsten Weide-Zaage, R. Roucou, R. T. H. Rongen, 2014, Microelectron. Reliab..

EPITAXIAL OXIDE THIN FILMS III

Tatsuo Fujii, L Niesen, F. C. Voogt, 1997 .