Chris Drijbooms

发表

Selective Epitaxy of Si/SiGe to Improve pMOS Devices by Recessed Source/Drain and/or Buried SiGe Channels

Akira Inoue, Rita Rooyackers, Denis Shamiryan, 2006 .

Copper Plating for 3D Interconnects

Hugo Bender, Wouter Ruythooren, Harold Philipsen, 2010, ECS Transactions.

Cu Plating of Through-Si Vias for 3D-Stacked Integrated Circuits

Hugo Bender, Wouter Ruythooren, Bart Swinnen, 2008 .