Y.K. Joshi

Scaling Analysis of Performance Tradeoffs in Electronics Cooling

C.E. Green, A.G. Fedorov, Y.K. Joshi, 2009, IEEE Transactions on Components and Packaging Technologies.

Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2005, IEEE Transactions on Components and Packaging Technologies.

Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations

H.Y. Zhang, D. Pinjala, Y.K. Joshi, 2005, IEEE Transactions on Components and Packaging Technologies.

A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic Jets

Y.K. Joshi, D.W. Gerlach, D. Gerty, 2009, IEEE Transactions on Advanced Packaging.